Circuits – Micron Laser

Micron Laser Technology specializes in PCB laser processing and services for many of the largest international PCB manufacturers and contract assembly. For more than 20 years, MLT has perfected laser processes and techniques that have advanced PCB manufacturers industry-wide.

Our PCB laser processes our customized for both rigid (PCB) and flexible circuit (FPC) applications. Most every possible PCB material stack-up has a laser parameter set or recipe maintained in a material database for quick setup and delivery.

Micron Laser Technology is experienced with all conventional dielectrics and chemistries used in rigid multilayer PCBs, FPCs, rigid-flex printed circuits, ceramics, and high-frequency materials. These may include Kapton™, polyimide, FR4, Isola, Getek, Nelco, Hitachi, Rogers, Gore, RCC, LCP, ceramics, speedboard, Teflon, Mylar, Duroid, acrylics, Ultralam, PEEK, PTFE, and FEP to name a few. For a more detailed listing of laser compatible materials used in PCB manufacturing, click PCB Materials. To view Rigid and Flex PCB Laser Services brochure, click PCB Laser Services Brochure.


MICRON LASER PCB Process Advantage

  • Microvia Vision Inspection
  • Advanced uVia Diameters Less than 25um
  • IPC Standards High Density Interconnect Types
  • Via Trax ™ Technology for Target Pad Surface Texturing
  • Lot/Panel Scale Reporting and Analysis for Drill Optimization
  • Large Via Process Technology that Inhibits Target Pad Delamination
  • Alignment and Scale Methodologies for Minimal Annular Ring Requirements


Shadow Masks

Low cost, quick turn alternative to photolithography masks (features >/= 25um).

Preform Routing

Cost-effective solution for converting most any sheet or roll stock materials into ‘preforms’.


Frame-less stencils are used for applying solder paste, flux, solder balls, and more.

Adhesives and Tapes

Laser cut adhesive, bonding film, PSA, or tape stock into any shape in sheet or roll formats.

General Laser Services

General laser services - cutting, drilling, skiving, marking, prototyping, & micromachining.

Brackets and Shims

Laser cut adhesive, bonding film, PSA, or tape stock into any shape in sheet or roll formats.

pcb services

Microvia Drilling

Blind, step, stacked, and through microvia drilling services for copper clad laminates.

PCB Routing

Laser routing is ideal for close tolerance rigid and flexible circuit board designs.

PCB Skiving

Laser skiving services that allow for the controlled removal of material.

Cavity Formation

Laser formed cavities in most dielectrics for embedding components or pad exposure.

ZIF Routing

Close tolerance routing of ZIF connectors applications with stiffeners.

Squeeze-out Removal

Laser removed adhesives or resins that squeezes out into unwanted areas.

Coverlay Routing

Nearly carbon-free, laser routed coverfilm or coverlay prior to lamination to PCB's.

Soldermask Removal

Selectively laser remove solder mask from unwanted areas like test points, pads, & holes.


Laser depaneling or part excising through metals, plastics, most dielectrics, and more.