Microvia Drilling – Micron Laser

Microvia Drilling




    Microvias are common to high density board designs of today. Micron Laser offers laser microvia drilling services in both copper clad and uncladed laminates. 

    Microvia hole diameters are limited by aspect ratio (hole depth to hole diameter). As the hole depth exceeds the hole diameter, laser drilling quality can be affected. Please indicate when your microvia application requirements exceed a 1:1 aspect ratio for consideration in the quoting process.

    There are many benefits to laser drilling microvias including real estate savings, impedance control, circuit reliability, and RF line termination. For this reason, Micron Laser has developed microvia laser drilling processes to work with a very wide range of materials and via profiles to fit your designs that meet IPC standards.

    Via Constructions

    Blind – single Stepped
    Microvia Single Deep Microvia Stepped
    Staggered Blind – double
    Microvia Staggered Microvia Double Deep
    Stacked Through-hole
    Microvia Stacked THRU_HOLE
    Infrared Ultraviolet
    Positional: +/-.002” (50um) +/-.001” (25um)
    Dimensional: +/-.002” (50um) +/-.001” (25um)

    CAD system integration and custom file converters enable flexible, laser manufacturing from customer-provided data. Although most file types are accepted, the preferred file types are Gerber, Excellon, DXF, or other 2D formats. In many cases where non-scaled data is required, MLT will make the appropriate scaling or offsets to meet part dimensions.

    If you are concerned about compatibility of your data format or CAD/CAM tool, please contact MLT Sales for more information. 503-439-9000  sales@micronlaser.com

    CAD / CAM guidelines are outlined in the following links.