Cavity Formation – Micron Laser

Cavity Formation

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    Micron Laser has specialized PCB cavity skiving processes. The cavity wall can be formed by existing openings in the copper (chemically or laser etched) acting as a mask or directly on exposed dielectric. Cavities formed with copper etched to the required cavity dimension create straight walls with minimal taper despite aspect ratios greater than 1:1.

    Depending on the material and its depth, laser direct cavity walls tend to exhibit taper along the wall height. MLT programming techniques can reduce the effective taper to below 10% of the cavity depth.

    In cases where standard plating preparation is insufficient in removing some micron level contaminates that inhibit plating, MLT provides a UV laser pass to the cavity surface to remove carbon contaminants that may be invisible to infra-red wavelengths.

    The process times or cost of laser produced cavities are based on the total volume of material removal. When cavity depths exceed .008″, mechanical pre-milling the cavity to within 5 mils of the target layer prior to laser can greatly reduce the laser cavity skiving costs. Laser skiving of PCB cavities can have limitations with some material stack-ups and tolerances. 

    Dielectrics
    Arlon CLTE Ceramics FR4 all types Getek
    Gore Hitachi Isola Mitsubishi BT's
    Nelco Rogers (Duroid & Teflon) Soldermask
    Taconic
    Reinforcements
    Aramid (Thermount) Ceramic Non-woven glass
    PTFE Woven Glass (106,1080,2216,2213,2313)
    Chemistries
    Acrylics BCB (benzocyclobutene) BT resins Cyanate ester
    Epoxy Epoxy blends FEP (fluorinated ethylene propylene)
    LCP (Liquid Crystal Polymer) PEEK (polyetheretherketone)
    Polyester Polyimide PPE (polyphenylene ether)
    Infrared Ultraviolet
    Positional: +/-.002” (50um) +/-.001” (25um)
    Dimensional: +/-.002” (50um) +/-.001” (25um)
    Depth: Application Dependent

    CAD system integration and custom file converters enable flexible, laser manufacturing from customer-provided data. Although most file types are accepted, the preferred file types are Gerber, Excellon, DXF, or other 2D formats. In many cases where non-scaled data is required, MLT will make the appropriate scaling or offsets to meet part dimensions.

    If you are concerned about compatibility of your data format or CAD/CAM tool, please contact MLT Sales for more information. 503-439-9000  sales@micronlaser.com

    CAD / CAM guidelines are outlined in the following links.

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