Depaneling – Micron Laser

Depaneling

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    Micron Laser provides laser depaneling or part excising services for consumer products, sheet or reel products, and printed circuit board manufacturers. Laser part excising can cut through metals, plastics, rubbers, dielectrics, or a combination of both.

    Depending on the material and part requirements, Micron Laser provides a tool-free part removal process in the form of final routing, hold-in tabs, or scoring. These laser processes have the following advantages:

    • Speed
    • Positional Accuracy
    • No Tooling Cost or Wear
    • Non-Contact - No Part Induced Stresses
    • No Cutting Oils or Other Contaminants

    Whether your PCB application is single-sided, double-sided, multi-layer, or rigid, MLT’s laser depaneling processes are configured for quick turns for most applications in prototype quantities to the highest volume levels.

    Infrared Ultraviolet
    Positional: +/-.002” (50um) +/-.001” (25um)
    Dimensional: +/-.002” (50um) +/-.001” (25um)

    CAD system integration and custom file converters enable flexible, laser manufacturing from customer-provided data. Although most file types are accepted, the preferred file types are Gerber, Excellon, DXF, or other 2D formats. In many cases where non-scaled data is required, MLT will make the appropriate scaling or offsets to meet part dimensions.

    If you are concerned about compatibility of your data format or CAD/CAM tool, please contact MLT Sales for more information. 503-439-9000  sales@micronlaser.com

    CAD / CAM guidelines are outlined in the following links.

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