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Micron Laser has specialized PCB cavity skiving processes. The cavity wall can be formed by existing openings in the copper (chemically or laser etched) acting as a mask or directly on exposed dielectric. Cavities formed with copper etched to the required cavity dimension create straight walls with minimal taper despite aspect ratios greater than 1:1.
Depending on the material and its depth, laser direct cavity walls tend to exhibit taper along the wall height. MLT programming techniques can reduce the effective taper to below 10% of the cavity depth.
In cases where standard plating preparation is insufficient in removing some micron level contaminates that inhibit plating, MLT provides a UV laser pass to the cavity surface to remove carbon contaminants that may be invisible to infra-red wavelengths.
The process times or cost of laser produced cavities are based on the total volume of material removal. When cavity depths exceed .008″, mechanical pre-milling the cavity to within 5 mils of the target layer prior to laser can greatly reduce the laser cavity skiving costs. Laser skiving of PCB cavities can have limitations with some material stack-ups and tolerances.
CAD system integration and custom file converters enable flexible, laser manufacturing from customer-provided data. Although most file types are accepted, the preferred file types are Gerber, Excellon, DXF, or other 2D formats. In many cases where non-scaled data is required, MLT will make the appropriate scaling or offsets to meet part dimensions.
If you are concerned about compatibility of your data format or CAD/CAM tool, please contact MLT Sales for more information. 503-439-9000 email@example.comCAD / CAM guidelines are outlined in the following links.