Coverlay Routing

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    Micron Laser processes all varieties of coverlay or coverfilm from DuPont, Hitachi, and Sheldahl to name a few. 

    Prior to coverlays being aligned and laminated on production panels, MLT can laser drill or rout the coverlay for the component feature openings. For post coverlay lamination, laser skiving processes are used remove the coverlay to expose underlying circuitry or pads.

    Coverlays and Adhesives:
    Kapton® -DuPont’s trademark for polyimide film
    Pyralux® -DuPont’s trademark for flexible circuit materials (Cu clad laminates, coverlays and bonding adhesives)
    Coverlay –Kapton coated with adhesive on one side (insulating material that is applied over a conductive pattern)
    Bondply –Kapton coated with adhesive on both sides

    Infrared Ultraviolet
    Positional: +/-.002” (50um) +/-.001” (25um)
    Dimensional: +/-.002” (50um) +/-.001” (25um)

    CAD system integration and custom file converters enable flexible, laser manufacturing from customer-provided data. Although most file types are accepted, the preferred file types are Gerber, Excellon, DXF, or other 2D formats. In many cases where non-scaled data is required, MLT will make the appropriate scaling or offsets to meet part dimensions.

    If you are concerned about compatibility of your data format or CAD/CAM tool, please contact MLT Sales for more information. 503-439-9000  sales@micronlaser.com

    CAD / CAM guidelines are outlined in the following links.

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