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Micron Laser’s PCB skiving services allows for the controlled removal of material for both rigid and flexible circuit board designs. Typical flexible circuit applications include window Kapton skiving of floating contacts (fingers) or pad exposures too small for mechanical drill/punch or registration to etched artwork. Rigid circuit skiving applications may include dry films and solder mask removal to cavity formations.
Laser skiving can be performed to clear all dielectric material or to stop without cutting all the way through (controlled depth). For skiving applications that require a controlled depth without landing on metal, the depth tolerance and cavity’s (or feature) surface topography is a function of the material. The more homogeneous the dielectric, the variation in depth tolerance will be minimized.
Whatever your skiving needs, Micron Laser has the solution!
CONTROL DEPTH LASER SKIVE
CAD system integration and custom file converters enable flexible, laser manufacturing from customer-provided data. Although most file types are accepted, the preferred file types are Gerber, Excellon, DXF, or other 2D formats. In many cases where non-scaled data is required, MLT will make the appropriate scaling or offsets to meet part dimensions.
If you are concerned about compatibility of your data format or CAD/CAM tool, please contact MLT Sales for more information. 503-439-9000 email@example.comCAD / CAM guidelines are outlined in the following links.