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Recover expensive populated or unpopulated circuit boards from inexpensive solder mask defects. Unwanted solder mask can be selectively laser removed from most areas test points, through holes, and ground pads on rigid or flex circuits.
Laser solder mask removal has the following advantages:
Micron Lasers laser solder mask removal processes produce minimal carbon redeposits and prepare the surface for immediate plating, tin, or solder. In some cases, surface prep processes (post laser) like plasma may promote plating adhesion.
A control depth removal of solder mask can be used to lower solder mask below a metal plane to remedy component or connector reflow issues. Similar control depth solder mask removal eliminates probe tip interferences that cause false opens or failures.
Laser selective solder mask removal will eliminated countless hours trying to manually rework solder mask by hand. Micron Laser solder mask removal services can put your assembly schedule back on track.
CAD system integration and custom file converters enable flexible, laser manufacturing from customer-provided data. Although most file types are accepted, the preferred file types are Gerber, Excellon, DXF, or other 2D formats. In many cases where non-scaled data is required, MLT will make the appropriate scaling or offsets to meet part dimensions.
If you are concerned about compatibility of your data format or CAD/CAM tool, please contact MLT Sales for more information. 503-439-9000 email@example.comCAD / CAM guidelines are outlined in the following links.