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Micron Laser's frame-less stencils are used for applying solder paste, flux, and solder balls to circuit boards, wafer, and components for prototyping, volume production, and PCB rework.
Laser cut stencils are precisely fabricated from your PCB’s Gerber layer files. Your quality stencils’ apertures are smooth being free from burrs and raised edges. Combined with laser accuracy and straight aperture wall profiles, transfer volumes and placement positioning are optimized.
Low cost or disposable stencils can be made from Mylar (PET), Kapton (polyimide), and other nonmetal materials that are used for simple masking or other PCB rework applications. These flexible stencils can be laser cut with an adhesive backing that allows for manual alignment and removal of the stencil.
Wafer stencils are an economical method for screening solder bumps onto a wafer (IC die). Micron Laser's laser cut wafer stencils accurately locate tens of thousands of the smallest apertures across a metalized surface.
CAD system integration and custom file converters enable flexible, laser manufacturing from customer-provided data. Although most file types are accepted, the preferred file types are Gerber, Excellon, DXF, or other 2D formats. In many cases where non-scaled data is required, MLT will make the appropriate scaling or offsets to meet part dimensions.
If you are concerned about compatibility of your data format or CAD/CAM tool, please contact MLT Sales for more information. 503-439-9000 email@example.comCAD / CAM guidelines are outlined in the following links.